The packaging business of Guangxi Tianmicro Electronics Co., Ltd. mainly includes SOP, QSOP, ESOP, SOT, SSOP, DIP, TSSOP, LQFP, QFN, FBGA, CSP, TO, IGBT and many other series, totaling over 100 varieties. In the next two years, we will focus on CSP and IGBT module advanced packaging.
Technical support contact number：15820490220
Wafer-level packaging
|
Package form
|
Production capacity/month
|
Plastization size（mm)
|
Pin Count
|
Lead Pitch（mm)
|
TL（mm)
|
Type（mil)
|
|
CSP
|
2kk
|
/
|
9
|
0.12
|
/
|
/
|
Die Bond
Wire Bond
Molding
Tirm Form
Testing
The packaging business of Guangxi Tianmicro Electronics Co., Ltd. mainly includes SOP, QSOP, ESOP, SOT, SSOP, DIP, TSSOP, LQFP, QFN, FBGA, CSP, TO, IGBT and many other series, totaling over 100 varieties. In the next two years, we will focus on CSP and IGBT module advanced packaging.
Technical support contact number：15820490220
Flip Chip Packaging
|
Package form
|
Production capacity/month
|
Plastization size（mm)
|
Pin Count
|
Lead Pitch（mm)
|
TL（mm)
|
Type（mil)
|
|
CSP
|
2kk
|
/
|
9
|
0.12
|
/
|
/
|
Die Bond
Wire Bond
Molding
Tirm Form
Testing
The packaging business of Guangxi Tianmicro Electronics Co., Ltd. mainly includes SOP, QSOP, ESOP, SOT, SSOP, DIP, TSSOP, LQFP, QFN, FBGA, CSP, TO, IGBT and many other series, totaling over 100 varieties. In the next two years, we will focus on CSP and IGBT module advanced packaging.
Technical support contact number：15820490220
Substrate Packaging
|
Package form
|
Production capacity/month
|
Plastization size（mm)
|
Pin Count
|
Lead Pitch（mm)
|
TL（mm)
|
Type（mil)
|
|
BGA
|
1KK
|
12*18*1.0
|
132
|
1.00
|
/
|
480*720
|
UDP
|
200K
|
11.4*15.1*1.45
|
4
|
1.30
|
/
|
456*604
|
SPI
|
1KK
|
6.1*8.1*0.75
|
8
|
1.25
|
/
|
240*320
|
TF
|
200K
|
11.1*15.1*1.1
|
8
|
1.10
|
/
|
444*604
|
Die Bond
Wire Bond
Molding
Tirm Form
Testing
The packaging business of Guangxi Tianmicro Electronics Co., Ltd. mainly includes SOP, QSOP, ESOP, SOT, SSOP, DIP, TSSOP, LQFP, QFN, FBGA, CSP, TO, IGBT and many other series, totaling over 100 varieties. In the next two years, we will focus on CSP and IGBT module advanced packaging.
Technical support contact number：13915261623
Leadframe Package
|
Package form
|
Production capacity/month
|
Plastization size（mm)
|
Pin Count
|
Lead Pitch（mm)
|
TL（mm)
|
Type（mil)
|
|
SOP8
|
36KK
|
4.90*3.90*1.45
|
8
|
1.270
|
6.00
|
150
|
|
SOP14
|
36KK
|
8.63*3.90*1.45
|
14
|
1.270
|
6.00
|
150
|
|
SOP16
|
22.5KK
|
9.90*3.90*1.45
|
16
|
1.270
|
6.00
|
150
|
|
SOP16(宽体）
|
6KK
|
10.35*7.50*2.34
|
16
|
1.270
|
6.00
|
300
|
|
SOP18
|
7KK
|
11.45*7.50*2.34
|
18
|
1.270
|
10.30
|
300
|
|
SOP20
|
3.5KK
|
12.60*7.50*2.30
|
20
|
1.270
|
10.35
|
300
|
|
SOP24
|
5KK
|
15.34*7.52*2.34
|
24
|
1.270
|
10.30
|
300
|
|
SOP28
|
16KK
|
17.93*7.52*2.34
|
28
|
1.270
|
10.30
|
300
|
|
SOP32
|
7KK
|
20.63*7.54*2.24
|
32
|
1.270
|
10.40
|
300
|
|
QSOP24
|
36KK
|
8.63*3.90*1.45
|
24
|
0.635
|
6.00
|
150
|
|
ESOP8
|
36KK
|
4.90*3.90*1.45
|
8
|
1.270
|
6.00
|
150
|
|
ESOP10
|
36KK
|
4.90*3.90*1.45
|
10
|
1.000
|
|
|
|
ESOP16
|
22.5KK
|
9.90*3.90*1.45
|
16
|
1.270
|
6.00
|
150
|
|
SOT23-3
|
35KK
|
2.90*1.65*1.10
|
3
|
1.900
|
2.90
|
/
|
|
SOT23-5
|
35KK
|
2.90*1.65*1.10
|
5
|
0.950
|
2.90
|
/
|
|
SOT23-6
|
35KK
|
2.90*1.65*1.10
|
6
|
0.950
|
2.90
|
/
|
|
SOT89-3
|
35KK
|
4.50*2.50*0.40
|
3
|
1.500
|
4.15
|
/
|
|
SSOP10
|
12KK
|
4.90*3.90*1.45
|
10
|
1.000
|
6.00
|
150
|
|
SSOP16
|
12KK
|
5.05*3.90*1.45
|
16
|
0.635
|
7.80
|
209
|
|
SSOP24
|
4.8KK
|
13.00*6.00*1.80
|
24
|
1.000
|
7.80
|
209
|
|
SSOP28
|
6KK
|
9.9*3.90*1.45
|
28
|
0.635
|
7.80
|
209
|
|
SSOP36
|
4.5KK
|
15.87*7.49*2.28
|
36
|
0.800
|
10.00
|
300
|
|
SSOP48
|
4.5KK
|
15.87*7.49*2.28
|
48
|
0.635
|
10.30
|
300
|
|
TSSOP16
|
12KK
|
5.05*3.90*1.45
|
16
|
0.635
|
6.00
|
150
|
|
TSSOP20
|
19.5KK
|
6.50*4.40*1.00
|
20
|
0.635
|
6.40
|
173
|
|
LQFP44
|
2KK
|
10.00*10.00*2.00
|
44
|
0.800
|
12.00
|
10*10
|
|
LQFP48
|
3.5KK
|
7.00*7.00*1.40
|
48
|
0.500
|
9.00
|
276
|
|
LQFP64
|
3.5KK
|
7.00*7.00*1.40
|
64
|
0.500
|
9.00
|
276
|
|
QFN24
|
1.7kk
|
4.00*4.00*0.75
|
24
|
0.500
|
4.00
|
/
|
|
QFN40
|
1.5kk
|
4.00*4.00*0.75
|
40
|
0.400
|
5.00
|
/
|
Die Bond
Wire Bond
Molding
TirmForm
Testing
The packaging business of Guangxi Tianmicro Electronics Co., Ltd. mainly includes SOP, QSOP, ESOP, SOT, SSOP, DIP, TSSOP, LQFP, QFN, FBGA, CSP, TO, IGBT and many other series, totaling over 100 varieties. In the next two years, we will focus on CSP and IGBT module advanced packaging.
Technical support contact number：13915261623
Discrete Devices
Package form
|
Production capacity/month
|
Plastization size（mm)
|
Pin Count
|
Lead Pitch（mm)
|
TL（mm)
|
Type（mil)
|
|
TO-252
|
3KK
|
6.2*6.7*2.39
|
3
|
2.286
|
2.74
|
248*268
|
TO-247
|
1.6kk
|
16.1*21.3*5.2
|
3
|
5.44
|
20.22
|
644*852
|
Die Bond
Wire Bond
Molding
Tirm Form
Testing
